Custom Special Shape 12 Inch 13 Slot Metal Wafer Carrier Cassette Series Products Are Used In Wafer Production

This metal cassette is designed for/with:Frame and Frame Shipper, Handling

(1)Wafer Type: 12 inch wafers

(2)Slot Qty: 25 slots (12 slots also available)

(3)Max Bake Temp: 450 deg C

(4)H Bar included: Yes

(5)Loading method: Robotic or Push Transfer loading

(6)Fabrication material: Stainless Steel 316L

Metal Frame Wafer Cassette antistatic material, light weight, air tight design for wafer protection.

Protects monolithic wafer frames from impact. Used for process to process conversion (cannot be used for chemical processes).

Can be engraved upon request and RFID enabled to track carriers and materials to ensure traceability during production.
Metal Box-Capacity for different semiconductor loading semiconductors, epitaxial chips, germination chips, wafers, in germination epitaxial solar wafers process, high temperature resistant, can be transferred in the factory.

Applications:

(1)Particle free, robust and dimensionally stable design.

(2) SEMI 300mm automation compliant, Automated or manual transfer.

(3) Durable wear-resistant material.

(4) Ergonomic fixed side handle, Lightweight design, available in vertical and horizontal.

(5) Secure transportation locking lever.

(6) Lighter than FOUP, Ideal for polyimide bake, BCB cure, copper anneal, as well as other cure processes.

All 316L SST welded, electropolished construction (no screws or fasteners).Dimensions similar to SEMI standard plastic machined carriers
Temperature: 316L stainless steel is suitable for temperatures up to 760ºC, but the recommended continuous operating temperature without distortion is 500ºC.
Corrosion resistance: 316L stainless steel has superior corrosion resistance to 302 and 304 stainless steel. It is resistant to a wide range of industrial chemicals and solvents, including sodium and calcium salts, hypochlorite solutions, phosphoric acid, sulfite solutions, and sulfurous acid.

Technical Parameters:

Certificates and patents:

(1).Quality Certification
Hiner-pack Wafer products have passed ISO9001 quality management system certification.
Obtained CE, RoHS and other health and environmental protection certificates.
Provide third-party inspection report to prove the stability of product quality.

(2).Aluminum alloy material test report
Explain the metal composition, strength, corrosion resistance and other indicators.

(3).Export license
Handle export license procedures such as commodity inspection and customs
Ensure that the products and packaging meet the standard requirements of the exporting countries
Provide packing list, commercial invoice and other export documents.

(4).Other certificates
According to the specific requirements of the destination country, provide the relevant certificates
Such as UL, REACH, LPC IC and other environmentally friendly certificates.
Ensure that the products fully meet the regulations and standards of the exporting country

Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Hiner-pack has established a depth of cooperation with well-known enterprises and built a polymer material R&D base with domestic well-known universities as well as scientific research institutions. Hiner-pack has mastered special processing techniques and manufacturing in the semiconductor packaging raw material field. Owned a lot of inventions and practical new patents. Through years of unremitting efforts, Hiner-pack has a professional R&D team to improve semiconductor packaging products, new products continue to be launched, and to solve the customer demand for high-quality products.

Learn more through our official website: https://www.hiner-pack.com/english/