8 Inch 25 Slot Visual Metal Wafer Cassette Used In Semiconductor Packaging Technology Industry

1.Product Description:

(1)Aluminum with wear-resistant, smooth hard-coating

(2)Heat-resistant up to 350°C (Al)

(3)Smooth slot-entry and -shape vacuum vented screws

(4)Design according to Semiconductor industry standard

2.Applications:

1. In a thermal process environment, wafers are processed in a cassette at temperatures in excess of 110° F (43° C), the upper limit of the typical structural threshold for plastic process cassettes.

This includes Chemical Vapor Deposition (CVD), Rapid Thermal Processing (RTP), and wafer annealing applications.
Bakeout - Long-term thermal bakeout applications where wafers need to be left in the oven for multiple days.

2. Process equipment where the wafer insertion temperature (wafer removed from the process tool) exceeds the melting point of the plastic case.

The need for higher throughput reduces the time for wafers to cool and acclimatize in the chamber.

3. Internal Environment Cassettes - Cluster tool automation environments where cassettes are idle in a heated vacuum environment (chamber) for multiple process steps.

4. Precision Carrier Requirements - Automated environments in moderate heat require dimensional accuracy that plastic cassettes cannot provide.

Thin Wafer Handling - During thin wafer handling, sharp thin wafers cut into the plastic case. Thick Wafer - Bonding or thick wafer applications where industry standard plastic cassettes cannot be used due to slot size.

Customization is available upon request.

Custom configurations are available (minimum order quantities may apply): EN electroless nickel plating on aluminum profiles for high vacuum applications; flat profile slotting for thin or thick wafers; end wall retaining handles; and dual h-bar configurations for backside wafer processing.

3. Technical Parameters:
(1) Process Aluminum Box: (Al, HC) 8” - 25 Slot, Slant Slot (Standard)
(2) Sizes: select size cover (top), (bottom) cover (top), custom H-BAR (bottom) H-BAR (top)
(3) Aluminum, abrasion-resistant, smooth hard coating
(4) Smooth grooves and shapes Vacuum vent screws
(5) Designed to SEMI standards

Packing and Shipping:

(1) Weight limitations.
The total weight of a single package should not exceed 25 kg.
Convenient for loading and unloading, meet the loading capacity of different means of transportation.

(2) Size specification.
Carton size should be less than 1.5 cubic meters.
Plastic cardboard, steel drums and other dimensions according to the actual size of the goods to determine
Ensure that the packaging can be loaded smoothly into the container, aircraft cargo cabin, etc.

(3) Documentation management.
Prepare bill of lading, invoice, packing list and other necessary documents.
Documentary information is complete and accurate, consistent with the actual goods.

Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Hiner-pack has established a depth of cooperation with well-known enterprises and built a polymer material R&D base with domestic well-known universities as well as scientific research institutions. Hiner-pack has mastered special processing techniques and manufacturing in the semiconductor packaging raw material field. Owned a lot of inventions and practical new patents. Through years of unremitting efforts, Hiner-pack has a professional R&D team to improve semiconductor packaging products, new products continue to be launched, and to solve the customer demand for high-quality products.

Learn more through our official website: https://www.hiner-pack.com/english/