Black PP 2 Inch 10+1 Waffle Pack Clip For IC Components Transport

According to the different needs of customers, Hiner-pack can provide lids and clamps with waffle packs. This can effectively hold the product to avoid shaking phenomenon. The combination of packaging is widely used in the packaging of small size electronic components.

At the same time, the clip is made of special plastic injection molding, which has the good anti-static function. The resistance value of the surface of the material is 1.0x10e4-1.0x10 e11Ω, so it can eliminate the static electricity of the product. It is suitable for the turnover loading, packaging, storage and transportation of electronic devices and products in the production process.

Details Of HN22113 Chip Tray Clip

This chip tray clip can be loaded with ten bottom and one cover, push and pull into the clip. After fixed, the product in the tray will not appear violent shaking. Even if the product is a tiny component, it can also greatly reduce the risk of products jumping out of the tray.

Compared with the traditional 1+1, 5+1 design, the 10+1 can carry more products, saving space and cost. In addition, the product is made of special plastic PP, which has good stability, anti-static and other properties. This makes the product light and can be very good protection of customer products.

Application of the Waffle Pack Clip

Electronic Component Embedded System

Micro and Nano System Power Supply

Advantages

1. Flexible OEM service: we can produce products according to customer’s sample or design.

2. Various Materials: the material can be MPPO.PPE.ABS.PEI.IDP...etc.

3. Complicated workmanship: tooling making, Injection molding,Production.

4. Comprehensive customer service: from customer consultation to after sales service.

5. 10 years experience of OEM for USA and EU customers.

6. We have our own factory and can control quality in high level and produce products quickly and flexibly.

FAQ

Q1: Are you a manufacturer?

Ans:Yes, We have ISO 9000 Quality Management System.

Q2: What information should we supply if we want a quotation?

Ans: Drawing of your IC or component, Quantity and size normally.

Q3: How long you could prepare samples?

Ans:Normally 3 days. If customized one, open new mold 25~30days around.

Q4: How about batch order production?

Ans: Normally 5-8 days or so.

Q5:Do you inspect the finished products?

Ans:Yes, We will do inspection according to ISO 9000 standard and ruled by our QC staff.

Q6: Could you put my logo in our product?

Ans:Yes, we can put your logo in our product, show us your logo firstly please.

Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Hiner-pack has established a depth of cooperation with well-known enterprises and built a polymer material R&D base with domestic well-known universities as well as scientific research institutions. Hiner-pack has mastered special processing techniques and manufacturing in the semiconductor packaging raw material field. Owned a lot of inventions and practical new patents. Through years of unremitting efforts, Hiner-pack has a professional R&D team to improve semiconductor packaging products, new products continue to be launched, and to solve the customer demand for high-quality products.

Learn more through our official website: https://www.hiner-pack.com/english/