2 Inch PP Black Push Pull IC Chip Tray Clip High Temperature Resistance

In order to keep the products inside the chip tray from shaking, it is usually recommended to use the waffle pack lid and clip together.This complete packing method can effectively prevent the product from being damaged and scratched during transportation.

At the same time this clip made of special plastic injection molding is strong and durable. It will not have any impact on the environment after being abandoned. It fully complies with ROHS international environmental standards. Customers don't have to worry about the environment at all.

Details of the HN21110 IC Chip Tray Clip

This clip can be hold a tray and a cover in the push and pull way. After being fixed,the product will not produce violent shaking in the tray. Even the tiny parts will not jump out the tray. This can perfectly transport the customer's various small products to avoid unnecessary worries.

The IC tray clip meet various international standards and pass ISO, SGS and other inspections. Our quality department must confirm that the products are 100% qualified before shipment. We have ten years of manufacturing experience and the products have been sold to well-known customers at home and abroad for many years.

Product Application of the HN21110 Waffle Pack Clip

Sensor Test and Measurement Technology

Electronic equipment and system Power Supply

Service of the HN21110 Chip Tray Clip

1.We offer ESD total Solution to Customer, Many other related product available if needed.

2.OEM is welcomed or design as customer request.

3.The best & professional sale services.

4.Honest but competitive price and Quality assured quotation.

5.100% QC inspection before shipment.

FAQ

1. How can I get a quotation?
Reply:Please provide the details of your requirements as clear as possible. So we can send you the offer at the first time.
For purchasing or further discussion, it is better to contact us with Skype / Email / Phone / Whats app, in case of any delays.

2. How long will it take to get a response?
Reply:We will reply to you within 24 hours of working day.

3. What kind of service we provide?
Reply:We can design IC Tray drawings in advance based on your clear description of the IC or component.Provide one-stop service from design to packaging and shipping.
4. What is your terms of delivery?
Reply:We accept EXW,FOB,CIF,DDU,DDP etc. You can choose the one which is the most convenient or cost effective for you.

5. How to guarantee quality?
Reply:Our samples through strict testing, the finished products comply with the international JEDEC standards, to ensure 100% qualified rate.

6. Could you put my logo in our product?
Reply:Yes, we can put your logo in our product, show us your logo firstly please.

7. When can we get the samples?
Reply:We can send you them right now if you are interested in something we have stock.

Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Hiner-pack has established a depth of cooperation with well-known enterprises and built a polymer material R&D base with domestic well-known universities as well as scientific research institutions. Hiner-pack has mastered special processing techniques and manufacturing in the semiconductor packaging raw material field. Owned a lot of inventions and practical new patents. Through years of unremitting efforts, Hiner-pack has a professional R&D team to improve semiconductor packaging products, new products continue to be launched, and to solve the customer demand for high-quality products.

Learn more through our official website: https://www.hiner-pack.com/english/