3*7 Matrix Black MPPO JEDEC Trays for IC Packaging Industry

Hiner-pack has a professional technical team and nearly 10 years of experience in IC tray matrix tray manufacturing. We offer a wide range of JEDEC matrix trays to meet our customers' stringent requirements for automated testing and processing environments.

Although the JEDEC standard provides various requirements for tray process equipment, it does not mean that the factory only needs to meet the basic standard requirements. On the contrary, each tray has its own unique requirements, and the factory should carefully supervise every step to provide customers with satisfactory trays.

Details about the HN21108 Matrix Black MPPO JEDEC Trays

The main material of HN21108 tray is MPPO, which is a kind of stable ESD material. It can well protect the customer production, while the tray also according to the color, height, material, heat temperature and other standards change.

This type of matrix tray is primarily used to automate testing and assembly processes. Integrated circuits and components are selected from the tray for testing or assembly into printed circuit boards. The tray is designed to be 45 degrees chamfered angle, providing an intuitive indication of the IC chip pin orientation, preventing error stacking, reducing the possibility of worker error and maximizing chip protection.

Application of the HN21108 Matrix JEDEC Tray

Electronic component Test and Measurement Technology

Military Industry Power supply

Reference to temperature resistance of different materials

Advantages

1. Suitable for components or devices daily turnover or long-distance freight.
2. Can be stacked more layers.
3. Can be washed at high temperature.
4. Plastic waterproof, moisture-proof, improve the storage time of components.
5. No extrusion and breakage, Better protection components.
6 .Reusable, quality assurance.

5.FAQ

Q1: Are You Manufacturer or Trade Company?

We are the 100% Manufacturer specialized in packaging over 10 years with 1500 square meters workshop area, located in Shenzhen China.

Q2: What is the material of your product?

ABS.PC.PPE.MPPO.PEI.HIPS...etc

Q3: Can you help with the design?

Yes, we can accept your customization and do the packaging for you according to your requirement.

Q4: How can I get the quotation of the custom products ?

Let us know the size of your IC or component thickness,and then we can make a quotation for you.

Q5: Can I get some samples before making a bulk order?

Yes, the fee sample in stock can be sent, but the shipping fee should be paid by yourself.

Q6: Could you put my logo in our product?
Yes, we can put your logo in our product, show us your logo firstly please.

Q7: When can we get the samples?
We can send you them right now if you are interested in something we have stock, and customize.

the project depending on the specific time.

Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Hiner-pack has established a depth of cooperation with well-known enterprises and built a polymer material R&D base with domestic well-known universities as well as scientific research institutions. Hiner-pack has mastered special processing techniques and manufacturing in the semiconductor packaging raw material field. Owned a lot of inventions and practical new patents. Through years of unremitting efforts, Hiner-pack has a professional R&D team to improve semiconductor packaging products, new products continue to be launched, and to solve the customer demand for high-quality products.

Learn more through our official website: https://www.hiner-pack.com/english/