ESD Black ABS 4 Inch Chip Tray for Electronic Parts 0.3 Flatness

The ESD tray is made of special high temperature resistant plastic and injection molding process. The resistance value of the material surface is 1.0x10e4 to1.0x10e11Ω. Because it can eliminate the static electricity of products, it is widely used in the turnover of loading, packaging, storage and transportation of electronic devices and the production process.

It is also known as conducting electrostatic tray which is a container for the storage of precision electronic components in the industry. According to the customer's electronic component requirements, Hiner-pack can also provide different sizes of waffle pack.

1.Details about the HN21094 ESD Black ABS 4 Inch Chip Tray

The HN21094 Waffle Pack is made of ABS, a good conducting material. This material can effectively release the static charge accumulated on the surface of the object, greatly reducing the damage rate of electronic products in the production process. This design not only reduces costs, but also improves product quality and profits.

At the same time, it also has anti-bending, anti-aging, high-bearing , stackable and other functions. We can customize all kinds of specifications and sizes according to user needs. It can be equipped with cover, dust proof and beautiful appearance. The ESD tray is designed and manufactured according to the size provided by customers to achieve the most reasonable loading.In addition, multiple trays can be overlapped to increase the storage of electronic components, PCB boards and dust-free workshop parts, so as to save production costs.

2.Application of the HN21094 ESD Black ABS Waffle pack

IC Electronic component Semiconductor Micro and Nano systems and Sensor IC

3.Our Service

1. We have sample stock and also can help the client to choose the type which is suitable for them.
2. We will reply you in any time if you have questions.
3. Choose suitable product for clients according to clients' requirement.
4. After mold customization, free samples will be provided until the customer tests OK, so as to remove the mass production quality concerns of customers before quantity.

4.FAQ

1. How can I get a quotation?
Reply:Please provide the details of your requirements as clear as possible. So we can send you the offer at the first time.
For purchasing or further discussion, it is better to contact us with Skype / Email / Phone, in case of any delays.

2. How long will it take to get a response?
Reply:We will reply to you within 24 hours of working day.

3. What kind of service we provide?
Reply:We can design IC Tray drawings in advance based on your clear description of the IC or component.Provide one-stop service from design to packaging and shipping.
4. What is your terms of delivery?
Reply:We accept EXW,FOB,CIF,DDU,DDP etc. You can choose the one which is the most convenient or cost effective for you.

5. How to guarantee quality?
Reply:Our samples through strict testing, the finished products comply with the international JEDEC standards, to ensure 100% qualified rate.

Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Hiner-pack has established a depth of cooperation with well-known enterprises and built a polymer material R&D base with domestic well-known universities as well as scientific research institutions. Hiner-pack has mastered special processing techniques and manufacturing in the semiconductor packaging raw material field. Owned a lot of inventions and practical new patents. Through years of unremitting efforts, Hiner-pack has a professional R&D team to improve semiconductor packaging products, new products continue to be launched, and to solve the customer demand for high-quality products.

Learn more through our official website: https://www.hiner-pack.com/english/