Customizable Black Colourful ESD Waffle Pack For IC RF VR Chips

Electronic Plastic ESD waffle pack is made of a layer of molecular polymer material. This material holds your component in place with surface adhesion. It is specially designed to provide safe, clean and precise packaging for high-value components that are resistant to abrasion and fragile. Even if tilt, vibration, or upside down, it can protect the product perfectly. Our products are widely used in optical crystal, laser crystal, optical communication crystal, optical wave plate, low light level components, semiconductor chip, electronic chip, biological chip packaging.

In addition, its operating temperature can be adapted to between -40 and 220 degrees Celsius. For 10 years, Hiner-pack has been providing standard or non-standard packaging solutions for many enterprises around the world with its cutting-edge technology in the design and rich expreience. We are involved in semiconductor products,data storage and many other industries. We can make a variety of specifications and sizes of waffle pack,The HN21074 ESD waffle pack is specially designed for chip transportation.

Details Of PN. HN21074 Waffle Pack IC Tray

The HN21074 is typically used to carry smaller chips. This not only realizes convenient transportation but also can carry a large number of chips. At the same time, our products are composed of a series of cover, clip, and other corresponding accessories. High quality and complete service packaging ensures the transfer, transportation and storage of customers' products.

The Application of ESD Waffle Pack

Semiconductor Chip Packing PCBA Module Component
Electronic Chip Packaging Biological Chip Packaging

The Packaging Of IC Tray Waffle Pack

Packaging Details:Packing according to the specifications specified by the customer

Our Advantages

1. Flexible OEM service: we can produce products according to customer’s sample or design.

2. Various Materials: the material can be MPPO.PPE.ABS.PEI.IDP...etc.

3. Complicated workmanship: tooling making, Injection molding,Production

4. Comprehensive customer service: from customer consultation to after sales service.

5. 10 years’ experience of OEM for USA and EU customers.

6. We have our own factory and The factory has iso9001.ROHS,SGS and other certificates.

7.Short lead time, generally available in stock

FAQ

Q1. Are you manufacturer or trade company?

A: We have our own factory and specialize in plastic packaging for more than 10 years.

Q2. How can I get the samples?

A: If you need some samples to test, we can make as per your request free of charge, but your company will have to pay for the freight.

Q3. How to place an order?

A: Firstly, please provide the Material, Thickness, Shape, Size, Quantity to confirm the price. We accept trail orders and small orders.

Q4. What is your terms of delivery?

A: EXW, FOB, CFR, CIF.

Q5. How about your delivery time?

A: Generally, it will take 7-10 working days after confirm the sample. The specific delivery time depends on the items and the quantity of your order.

Q6. Can you produce according to the samples?

A: Yes, we can produce by your samples or technical drawings.

Q7. What is your sample policy?

A: We can supply the sample if we have similar products in stock, if no similar products, customers shall pay the tooling cost and the courier cost, the tooling cost can be returned according to the specific order.

Q8. Do you test all your goods before delivery?

A: Yes, we have 100% test before delivery

Q9: How do you make our business long-term and good relationship?

A: 1. We keep good quality and competitive price to ensure our customers benefit

2 We respect every customer as our friend and we sincerely do business and make friends with them, no matter where they come from.

Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Hiner-pack has established a depth of cooperation with well-known enterprises and built a polymer material R&D base with domestic well-known universities as well as scientific research institutions. Hiner-pack has mastered special processing techniques and manufacturing in the semiconductor packaging raw material field. Owned a lot of inventions and practical new patents. Through years of unremitting efforts, Hiner-pack has a professional R&D team to improve semiconductor packaging products, new products continue to be launched, and to solve the customer demand for high-quality products.

Learn more through our official website: https://www.hiner-pack.com/english/