Packing Wafer Die PC Bare Die Trays ESD Injection Moulding

Waffle Pack Chip Carriers Series Products Used For Packing Wafer Die

Reference Detail

Application

IC, Electronic component, Semiconductor, Micro and Nano systems and Sensor IC etc

Advantage

1. Have exported for more than 10 years
2. Have professional engineer and efficient management
3. Delivery time is short, normally in stock
4. Small quantity is allowed.
5. The best & professional sale services, 24hours Response.
6. Our products have been exported to USA, Germany, UK, Europe, Korea, Japan...etc, Win many big famous customer reputation.
7. Factory have ISO certificate, Product comply to Rohs standard.

FAQ

Q1. Do your products get any certificates?
Yes, CE for EU market, FDA for USA market.
Q2.Can you do the design for us?
Yes. We have a professional team having rich experience in designing and manufacturing. Just tell us your ideas and we will help to carry out your ideas into perfect fact. It does not matter if you do not have some one to complete files. Send us high resolution images, your logo and text and tell us how you would like to arrange them. We will send you finished files for confirmation.
Q3. How long is the delivery time?
For standard machine, it would be 5-7Working days. For non-standard/customized machines according to clients' specific requirements, It would be 20~25 working days.

Q4. Do you arrange shipment for the products?

It’s depends on our incoterms,If FOB or CIF price, we will arrange shipment for you, but EXW price, clients need to arrange shipment by themselves or their agents.

Q5. How about the documents after shipment?
After shipment, we'll send all original documents to you by DHL, including Commercial Invoice, Packing List, B/L and other certificates as required by clients.

Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Hiner-pack has established a depth of cooperation with well-known enterprises and built a polymer material R&D base with domestic well-known universities as well as scientific research institutions. Hiner-pack has mastered special processing techniques and manufacturing in the semiconductor packaging raw material field. Owned a lot of inventions and practical new patents. Through years of unremitting efforts, Hiner-pack has a professional R&D team to improve semiconductor packaging products, new products continue to be launched, and to solve the customer demand for high-quality products.

Learn more through our official website: https://www.hiner-pack.com/english/