ESD 4 Inch Black Waffle Tray Packaging Lids High Temperature Resistance Cover

High Temperature Durable 4 Inch Black Waffle Pack Lids For IC Chip Tray Cover

The cover and insert materials are generally made of ABS or PC and industry standard anti-static Tyvek paper.

Manual placement, dislocation, and squeezing of the Tyvek paper are avoided when loading the waffle package

Seal each individual pallet pocket evenly

Compensate for normal waffle packaging cover/tray warping conditions, resulting in notching, fixed product elements do not move

Save a lot of scrap costs caused by yield loss, rework, and mold component movement.

Advantages:

1. Suitable for components or devices with daily turnover or long-distance freight;
2. Can be stacked with more layers;
3. Can be washed at high temperature;
4. Plastic waterproof, moisture-proof, improves the storage time of components;
5. No extrusion and breakage, Better protection components；
6. Reusable, quality assurance.

Application:

Wafer Dicing; Wafer Sorting; Wafer / Die Pick and place; Wafer/ Die Shipping.

Technical Parameters:

FAQ:

Q1: Are you a manufacturer?
A: Yes, we are a 100% manufacturer specializing in packaging for over 12 years with a 1500 square meter workshop area, located in Shenzhen, China.
Q2: What information should we supply if we want a quotation?
A: Drawing of your IC or component, Quantity, and size normally.

Q3: How long could you prepare samples?
A: Normally, 3 days. If customized, open a new mold 25~30 days around.
Q4: How about batch order production?
A: Normally 5- 7 working days or so.
Q5: Do you inspect the finished products?
A: Yes, we will inspect according to the ISO 9001 standard and be ruled by our QC staff.

Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Hiner-pack has established a depth of cooperation with well-known enterprises and built a polymer material R&D base with domestic well-known universities as well as scientific research institutions. Hiner-pack has mastered special processing techniques and manufacturing in the semiconductor packaging raw material field. Owned a lot of inventions and practical new patents. Through years of unremitting efforts, Hiner-pack has a professional R&D team to improve semiconductor packaging products, new products continue to be launched, and to solve the customer demand for high-quality products.

Learn more through our official website: https://www.hiner-pack.com/english/