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Recycled ESD Custom JEDEC Trays Die Transport BGA Chips High Temperature Resistance

Shenzhen Hiner Technology Co.,LTD
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    Buy cheap Recycled ESD Custom JEDEC Trays Die Transport BGA Chips High Temperature Resistance from wholesalers
     
    Buy cheap Recycled ESD Custom JEDEC Trays Die Transport BGA Chips High Temperature Resistance from wholesalers
    • Buy cheap Recycled ESD Custom JEDEC Trays Die Transport BGA Chips High Temperature Resistance from wholesalers
    • Buy cheap Recycled ESD Custom JEDEC Trays Die Transport BGA Chips High Temperature Resistance from wholesalers
    • Buy cheap Recycled ESD Custom JEDEC Trays Die Transport BGA Chips High Temperature Resistance from wholesalers
    • Buy cheap Recycled ESD Custom JEDEC Trays Die Transport BGA Chips High Temperature Resistance from wholesalers
    • Buy cheap Recycled ESD Custom JEDEC Trays Die Transport BGA Chips High Temperature Resistance from wholesalers

    Recycled ESD Custom JEDEC Trays Die Transport BGA Chips High Temperature Resistance

    Ask Lasest Price
    Brand Name : Hiner-pack
    Model Number : HN1839 Black
    Certification : ISO 9001 ROHS SGS
    Price : $1.35~$2.38(Prices are determined according to different incoterms and quantities)
    Payment Terms : T/T
    Supply Ability : The capacity is between 2500PCS~3000PCS/per day
    Delivery Time : 5~8 working days
    • Product Details
    • Company Profile

    Recycled ESD Custom JEDEC Trays Die Transport BGA Chips High Temperature Resistance

    Recycled ESD Custom JEDEC Trays Transport BGA Chips High Temperature Resistance
    Engineered for precision and protection, our JEDEC trays are fully customizable to fit your unique chip or module dimensions.


    The design of the structure and shape in line with JEDEC international standards can also perfectly meet the requirements of the carrying components or IC of the tray, carrying function to meet the requirements of the automatic feeding system, to achieve the modernization of loading, and improve work efficiency.


    Providing a variety of packaging IC design solutions based on your chip, the 100% custom tray is not only suitable for storing ICs but also better protects the chip storage.We have designed a lot of packaging ways, which also include common BGA, FBGA, LGAQFN, QFP, PGA, TQFP, LQFP, SoC, and SiP, etc. We can provide custom service for all packaging methods of the chip tray.

    Benefits:

    • Able to present non-standard components to the Pick and Place machines.

    • Multiple uses for the fixture, including component bake-out, storage, and shipping.

    • Cost-effective alternative to “tape and reel” or “hand” placement.

    Application:

    IC, Electronic component, Semiconductor, Micro and Nano systems, and Sensor IC, etc.

    Technical Parameters:

    ModelHN1839Package TypeBGA IC
    Cavity Size12*12*1.8mmSizeCustomized
    MaterialPPEFlatnessMAX 0.76mm
    Resistance1.0x10e4-1.0x10e11ΩServiceAccept OEM, ODM
    ColorGreen &BlackCertificateROHS


    UsagePackaging of Electronic Components, Optical device,
    FeatureESD, Durable, High Temperature, Waterproof, Recycled, Eco-friendly
    MaterialMPPO.PPE.ABS.PEI.IDP...etc
    ColorBlack.Red.Yellow.Green.White and custom color
    SizeCustomized size, rectangle, circle shape
    Mold typeInjection Mold
    DesignOriginal sample, or we can create the designs
    PackingBy Carton
    SampleSample time: after the draft is confirmed and payment is arranged
    Sample charge: 1. Free for stock samples
    2. Custom tray negotiated
    Lead Time5-7 Working days
    The exact time should be according to the ordered quantity

    FAQ:

    Q1. Do your products get any certificates?
    Yes, CE for the EU market, FDA for the USA market.
    Q2.Can you do the design for us?
    Yes. We have a professional team having rich experience in designing and manufacturing. Just tell us your ideas and we will help to carry out your ideas into a perfect fact. It does not matter if you do not have someone to complete the files. Send us high-resolution images, your logo, and text, and tell us how you would like to arrange them. We will send you finished files for confirmation.
    Q3. How long is the delivery time?
    For a standard machine, it would be 5- 7 working days. For non-standard/customized machines according to clients' specific requirements, It would be 20~25 working days.
    Q4. Do you arrange shipments for the products?

    It depends on our Incoterms. If it is FOB or CIF price, we will arrange shipment for you, but EXW price, clients need to arrange shipment by themselves or their agents.
    Q5. How about the documents after shipment?
    After shipment, we'll send all original documents to you by DHL, including Commercial Invoice, Packing List, B/L, and other certificates as required by clients.

    Quality Recycled ESD Custom JEDEC Trays Die Transport BGA Chips High Temperature Resistance for sale
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