2 Inch 4Inch Transparent Waffle Pack Lid Black Color Anti Static Material

Match With Waffle Pack Black 2 Inch 4Inch Transparent and Black lid

Anti-static material can effectively release the static charge accumulated on the surface of the object, so that it will not produce charge accumulation and high potential difference; It can greatly reduce the damage rate of electronic products in the production process, reduce the cost, and improve the product quality and profit.

The lid is designed to work with a new highly engineered clip that uniformly compresses the tray and lid together

waffle pack lids are comprised of a 2” polycarbonate lid with a thick pad and interleaf material laminated to the inside surface. The lids seal pockets of industry standard waffle pack chip trays to prevent die from moving or migrating during shipping, handling and processing.

Character Reference

The cover and insert materials are generally made of industry standard anti-static Tyvek paper and ABS or PC.

Manual placement, dislocation and/or squeezing of the Tyvek paper is avoided when loading the waffle package

Seal each individual pallet pocket evenly

Compensate for normal waffle packaging cover/tray warping conditions, resulting in notching, fixed product elements do not move

Save a lot of scrap costs caused by yield loss, rework and mold component movement.

Advantages

1. Suitable for components or devices daily turnover or long-distance freight.
2. Can be stacked more layers;
3. Can be washed at high temperature;
4. Plastic waterproof, moisture-proof, improve the storage time of components;
5. No extrusion and breakage, Better protection components；
6. Reusable, quality assurance.

Application

Wafer Dicing

Wafer Sorting

Wafer / Die Pick and place

Wafer/ Die Shipping

FAQ

Q1. Do your products get any certificates?
Yes, CE for EU market, FDA for USA market.

Q2.Can you do the design for us?
Yes. We have a professional team having rich experience in designing and manufacturing. Just tell us your ideas and we will help to carry out your ideas into perfect fact. It does not matter if you do not have some one to complete files. Send us high resolution images, your logo and text and tell us how you would like to arrange them. We will send you finished files for confirmation.

Q3. How long is the delivery time?
For standard machine, it would be 5-7Working days. For non-standard/customized machines according to clients' specific requirements, It would be 20~25 working days.

Q4. Do you arrange shipment for the products?

It’s depends on our incoterms,If FOB or CIF price, we will arrange shipment for you, but EXW price, clients need to arrange shipment by themselves or their agents.

Q5. How about the documents after shipment?
After shipment, we'll send all original documents to you by DHL, including Commercial Invoice, Packing List, B/L and other certificates as required by clients

Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Hiner-pack has established a depth of cooperation with well-known enterprises and built a polymer material R&D base with domestic well-known universities as well as scientific research institutions. Hiner-pack has mastered special processing techniques and manufacturing in the semiconductor packaging raw material field. Owned a lot of inventions and practical new patents. Through years of unremitting efforts, Hiner-pack has a professional R&D team to improve semiconductor packaging products, new products continue to be launched, and to solve the customer demand for high-quality products.

Learn more through our official website: https://www.hiner-pack.com/english/