Eco Friendly PP Waffle Pack Lids Clips 2 Inch Injection Molding

Packing 1Tray 1Cover Or 1 Tray 2-Inch ESD 1*2 Pair Plastic Clip

1*2 pair of clamp design, can be inserted from the chamfer position, or separately from the two sides of the insertion, simple and convenient operation.

Chip trays are used to provide clean, secure packaging for bare die and other microelectronics devices. We stock a wide variety of chip trays (waffle packs) in various sizes and materials. Available chip tray sizes are 2″ x 2″ square trays or 4″ x 4″ square trays. Chip trays should be selected for the pocket size that will provide a good fit for each individual device, without allowing the devices to rotate or flip over in the pocket, once the cover is attached and secured by the clip.

Product Application

Electronic component Semiconductor Embedded System Display technology

Micro and Nano systems Sensor Test and Measurement Techology
Electromechanical equipment and systems Power supply

Material Description

ESD Conductive Material

Also can be antistatic or Conductive and can be normal one .

FAQ

Q1: Are you a manufacturer?
Ans: Yes, We have ISO 9000 Quality Management System.

Q2: What information should we supply if we want a quotation?
Ans: Drawing of your IC or component, Quantity and size normally.

Q3: How long you could prepare samples?
Ans: Normally 3 days. If customized one, open new mold 25~30days around.

Q4: How about batch order production?
Ans: Normally 5-8days or so.

Q5: Do you inspect the finished products?
Ans: Yes, We will do inspection according to ISO 9000 standard and ruled by our QC staff.

Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Hiner-pack has established a depth of cooperation with well-known enterprises and built a polymer material R&D base with domestic well-known universities as well as scientific research institutions. Hiner-pack has mastered special processing techniques and manufacturing in the semiconductor packaging raw material field. Owned a lot of inventions and practical new patents. Through years of unremitting efforts, Hiner-pack has a professional R&D team to improve semiconductor packaging products, new products continue to be launched, and to solve the customer demand for high-quality products.

Learn more through our official website: https://www.hiner-pack.com/english/