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Customized Black ESD JEDEC IC Trays Ultrasonic Cleaning For PCBA Module

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Shenzhen Hiner Technology Co., Ltd.

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Customized Black ESD JEDEC IC Trays Ultrasonic Cleaning For PCBA Module

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Brand Name :	Hiner-pack
Model Number :	HN18102
Certification :	ISO 9001 ROHS SGS
Price :	$1.35~$2.38(Prices are determined according to different incoterms and quantities）
Payment Terms :	T/T
Supply Ability :	The capacity is between 2500PCS~3000PCS/per day
Delivery Time :	5~8 working days

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Customized Black ESD JEDEC IC Trays Ultrasonic Cleaning For PCBA Module

Precision-molded cavities ensure a perfect fit for your chip or module, reducing movement and contamination during handling.

1. Standard JEDEC Tray Outline size is 322.6 X 135.9 X 7.62 mm or 322.6*135.9*12.19mm.

2. The production process is injection-molded.

3. Rich experience and mature design team in the field of injection molding products, providing one-stop services from design to mold to product packaging.

While the JEDEC Tray is widely used in the semiconductor industry, the PCB module market is slowly recognizing and using custom trays to transport and load modules, because it can not only fully meet customer requirements in terms of performance, but also match the market demand for high-end modules. The IC Tray has been fully recognized in different industries. We have accumulated a wealth of experience in loading different ICs and modules, and have produced many similar series of trays.

Application:

Package IC; PCBA module component; Electronic component packaging; Optical device packaging

Technical Parameters:

Brand	Hiner-pack	Outline Line Size	322.6135.97.62mm
Model	HN 18102	Cavity Size	35353.05mm
Package Type	PCBA	Matrix QTY	3*7=21PCS
Material	PPE	Flatness	MAX 0.76mm
Color	Black	Service	Accept OEM, ODM
Resistance	1.0x10e4-1.0x10e11Ω	Certificate	RoHS

Reference to the temperature resistance of different materials:

Material	Bake Temperature	Surface Resistance
PPE	Bake 125°C~Max 150°C	1.010E4Ω~1.010E11Ω
MPPO+Carbon Fiber	Bake 125°C~Max 150°C	1.010E4Ω~1.010E11Ω
MPPO+Carbon Powder	Bake 125°C~Max 150°C	1.010E4Ω~1.010E11Ω
MPPO+Glass Fiber	Bake 125°C~Max 150°C	1.010E4Ω~1.010E11Ω
PEI+Carbon Fiber	Max 180°C	1.010E4Ω~1.010E11Ω
IDP Color	85°C	1.010E6Ω~1.010E10Ω
Color, temperature, and other special requirements can be customized

FAQ:

1. How can I get a quotation?
Reply: Please provide the details of your requirements as clearly as possible. So we can send you the offer for the first time.
For purchasing or further discussion, it is better to contact us with Skype / Email / Phone / Whatsapp, in case of any delays.

2. How long will it take to get a response?
Reply: We will reply to you within 24 hours of the working day.

3. What kind of service do we provide?
Reply: We can design IC Tray drawings in advance based on your clear description of the IC or component. Provide one-stop service from design to packaging and shipping.
4. What are your terms of delivery?
Reply: We accept EXW, FOB, CIF, DDU, DDP, etc. You can choose the one that is the most convenient or cost-effective for you.

5. How to guarantee quality?
Reply: Our samples through strict testing, the finished products comply with the international JEDEC standards, to ensure a 100% qualified rate.

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