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ODM PCB Module ESD Black IC Packaging Trays Heat-Resistant

Shenzhen Hiner Technology Co.,LTD
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    Buy cheap ODM PCB Module ESD Black IC Packaging Trays Heat-Resistant from wholesalers
     
    Buy cheap ODM PCB Module ESD Black IC Packaging Trays Heat-Resistant from wholesalers
    • Buy cheap ODM PCB Module ESD Black IC Packaging Trays Heat-Resistant from wholesalers
    • Buy cheap ODM PCB Module ESD Black IC Packaging Trays Heat-Resistant from wholesalers
    • Buy cheap ODM PCB Module ESD Black IC Packaging Trays Heat-Resistant from wholesalers
    • Buy cheap ODM PCB Module ESD Black IC Packaging Trays Heat-Resistant from wholesalers

    ODM PCB Module ESD Black IC Packaging Trays Heat-Resistant

    Ask Lasest Price
    Brand Name : Hiner-pack
    Model Number : HN1903
    Certification : ISO 9001 ROHS SGS
    Price : $1.35~$2.38(Prices are determined according to different incoterms and quantities)
    Payment Terms : T/T
    Supply Ability : The capacity is between 2500PCS~3000PCS/per day
    Delivery Time : 5~8 working days
    • Product Details
    • Company Profile

    ODM PCB Module ESD Black IC Packaging Trays Heat-Resistant

    ODM PCB Module ESD Black IC Packaging Trays Heat-Resistant

    Go beyond off-the-shelf—get JEDEC trays engineered for your chip’s shape, height, and transportation needs.

    While the JEDEC Tray is widely used in the semiconductor industry, the PCB module market is slowly recognizing and using custom trays to transport and load modules, because it can not only fully meet customer requirements in terms of performance, but also match the market demand for high-end modules. The IC Tray has been fully recognized in different industries. We have accumulated a wealth of experience in loading different ICs and modules, and have produced many similar series of trays.

    The tray has a 45-degree chamfer to provide a visual indicator of Pin 1 orientation of the IC and prevent the stack of errors, reduce the possibility of workers making mistakes, and maximize the protection of the chip.

    Application:

    Package IC, PCBA module component, Electronic component packaging, Optical device packaging

    Technical Parameters:

    BrandHiner-packOutline Line Size322.6*135.9*7.62mm
    ModelHN1903Cavity Size43*38*3.25mm
    Package TypePCB ModuleMatrix QTY6*3=18PCS
    MaterialPPEFlatnessMAX 0.76mm
    ColorBlackServiceAccept OEM, ODM
    Resistance1.0x10e4-1.0x10e11ΩCertificateRoHS

    Reference to the temperature resistance of different materials:

    MaterialBake TemperatureSurface Resistance
    PPEBake 125°C~Max 150°C1.0*10E4Ω~1.0*10E11Ω
    MPPO+Carbon FiberBake 125°C~Max 150°C1.0*10E4Ω~1.0*10E11Ω
    MPPO+Carbon PowderBake 125°C~Max 150°C1.0*10E4Ω~1.0*10E11Ω
    MPPO+Glass FiberBake 125°C~Max 150°C1.0*10E4Ω~1.0*10E11Ω
    PEI+Carbon FiberMax 180°C1.0*10E4Ω~1.0*10E11Ω
    IDP Color85°C1.0*10E6Ω~1.0*10E10Ω
    Color, temperature, and other special requirements can be customized


    FAQ:

    1. How can I get a quotation?
    Reply: Please provide the details of your requirements as clearly as possible. So we can send you the offer for the first time.
    For purchasing or further discussion, it is better to contact us via Skype / Email / Phone / WhatsApp, in case of any delays.

    2. How long will it take to get a response?
    Reply: We will reply to you within 24 hours of the working day.

    3. What kind of service do we provide?
    Reply: We can design IC Tray drawings in advance based on your clear description of the IC or component. Provide one-stop service from design to packaging and shipping.
    4. What are your terms of delivery?
    Reply: We accept EXW, FOB, CIF, DDU, DDP, etc. You can choose the one that is the most convenient or cost-effective for you.

    5. How to guarantee quality?
    Reply: Our samples through strict testing, and the finished products comply with the international JEDEC standards, to ensure a 100% qualified rate.

    Quality ODM PCB Module ESD Black IC Packaging Trays Heat-Resistant for sale
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