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QFP Package ESD IC Trays JEDEC Standard Max 0.76mm Flatness

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Shenzhen Hiner Technology Co., Ltd.

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QFP Package ESD IC Trays JEDEC Standard Max 0.76mm Flatness

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Brand Name :	Hiner-pack
Model Number :	HN1968
Certification :	ISO 9001 ROHS SGS
Price :	$1.35~$2.38(Prices are determined according to different incoterms and quantities）
Payment Terms :	T/T
Supply Ability :	The capacity is between 2500PCS~3000PCS/per day
Delivery Time :	5~8 working days

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Product Details
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QFP Package ESD IC Trays JEDEC Standard Max 0.76mm Flatness

QFP Package ESD IC Trays JEDEC Standard Max 0.76mm Flatness

Anti-static PPE Standard JEDEC Trays Customized For Carry QFP Package IC

Detail Description:

Tray of QFP package way,Really need to pay special attention to protect the edge of the pin location, structure and shape, different pin each sensitive area is different need to be protected, IC tray design is the first need to consider is safe packing storage chip, the IC package of reason for different ways have different design methods, this QFP IC two side both have pin structure,Our designer added grooves on both sides, so that the pins can be placed smoothly to avoid being touched, and the middle card slot can also be fixed on the chip, so that it can be picked up by automatic equipment on the basis of safe storage of the chip, which is more conducive to shipment and storage.

Providing a variety of packaging IC design solutions based on your chip, the 100% custom tray is not only suitable for storing IC but also better protect the chip storage.We have designed a lot of packaging way, which also contains common BGA, FBGA, LGAQFN, QFP, PGA, TQFP, LQFP, SoC and SiP, etc.We can provide custom service for all packaging methods of chip tray.

Outline Line Size	322.6135.912.19mm	Brand	Hiner-pack
Model	HN1968	Package Type	QFP IC
Cavity Size	22226.9	Matrix QTY	11*4=44pcs
Material	PPE	Flatness	MAX 0.76mm
Color	Black	Service	Accept OEM,ODM
Resistance	1.0x10e4-1.0x10e11Ω	Certificate	ROHS

Product Application

Package IC PCBA module component

Electronic component packaging Optical device packaging

Packaging

Packaging Details:Packing according to customer's specified size

Reference to temperature resistance of different materials

Material	Bake Temperature	Surface Resistance
PPE	Bake 125°C~Max 150°C	1.010E4Ω~1.010E11Ω
MPPO+Carbon Fiber	Bake 125°C~Max 150°C	1.010E4Ω~1.010E11Ω
MPPO+Carbon Powder	Bake 125°C~Max 150°C	1.010E4Ω~1.010E11Ω
MPPO+Glass Fiber	Bake 125°C~Max 150°C	1.010E4Ω~1.010E11Ω
PEI+Carbon Fiber	Max 180°C	1.010E4Ω~1.010E11Ω
IDP Color	85°C	1.010E6Ω~1.010E10Ω
Color, temperature and other special requirements can be customized

FAQ

1. How can I get a quotation?
Reply:Please provide the details of your requirements as clear as possible. So we can send you the offer at the first time.
For purchasing or further discussion, it is better to contact us with Skype / Email / Phone / Whatsapp, in case of any delays.

2. How long will it take to get a response?
Reply:We will reply to you within 24 hours of working day.

3. What kind of service we provide?
Reply:We can design IC Tray drawings in advance based on your clear description of the IC or component.Provide one-stop service from design to packaging and shipping.
4. What is your terms of delivery?
Reply:We accept EXW,FOB,CIF,DDU,DDP etc. You can choose the one which is the most convenient or cost effective for you.

5. How to guarantee quality?
Reply:Our samples through strict testing, the finished products comply with the international JEDEC standards, to ensure 100% qualified rate.

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