JEDEC Standard Custom Trays With Surface Resistance Stackable Design

Engineered for high-volume semiconductor manufacturing and sensitive component handling, JEDEC matrix tray offers a balance of rigidity, ESD safety, and automation readiness.

Its form-fitting cell structure provides consistent alignment and secure seating for devices during high-speed operations. The tray features molded indexing cues and flat interior surfaces, making it well-suited for robotic vacuum pick-up and conveyor transport. It delivers excellent mechanical protection while integrating effortlessly into existing automated systems, ensuring seamless compatibility from production to final packaging.

Features & Benefits:

• JEDEC Standard Compliance: Supports industry-wide handling, test, and assembly systems through consistent external dimensions and alignment features.

• Anti-Static Protection: The conductive material composition provides continuous electrostatic discharge control for sensitive electronic devices.

• Precision Pockets: Uniform pocket geometry ensures repeatable orientation and reliable part presentation throughout the process chain.

• Automation-Optimized: Designed with flat pocket floors, pickup points, and alignment tabs that enhance robotic handling speed and accuracy.

• Process Durability: Maintains shape and structural integrity under various processing conditions, including mechanical stress and repeated stacking.

• Stable Stackability: Built-in interlocking edges reduce tray movement in stacked configurations, supporting safer material handling and compact storage.

Technical Parameters:

Applications:

This tray is commonly used in automated test handlers, IC programming systems, SMT placement lines, and packaging stations. Its design helps minimize part movement, supports robotic alignment systems, and facilitates high-efficiency workflows. Ideal for semiconductor plants, OEM assembly lines, and advanced electronics labs, the tray streamlines movement between workstations while maintaining component protection and accurate orientation.

To accommodate unique production or component needs, the tray can be tailored as follows:

• Custom Pocket Profiles: Adapt the pocket shape or depth to fit specific semiconductor packages or module geometries.

• Color Customization: Choose from a range of static-dissipative colors to match production lines, product types, or QA stages.

• Molded Marking Options: Integrate batch identifiers, part numbers, or other molded-in indicators for tracking and process verification.

• Feature Enhancements: Add specialized tabs, channels, or indexing features to align with proprietary automation or inspection systems.