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BGA QFP QFN LGA PGA IC Type JEDEC Trays Surface Resistant Suitable For IC Packaging

Shenzhen Hiner Technology Co.,LTD
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    Buy cheap BGA QFP QFN LGA PGA IC Type JEDEC Trays Surface Resistant Suitable For IC Packaging from wholesalers
     
    Buy cheap BGA QFP QFN LGA PGA IC Type JEDEC Trays Surface Resistant Suitable For IC Packaging from wholesalers
    • Buy cheap BGA QFP QFN LGA PGA IC Type JEDEC Trays Surface Resistant Suitable For IC Packaging from wholesalers
    • Buy cheap BGA QFP QFN LGA PGA IC Type JEDEC Trays Surface Resistant Suitable For IC Packaging from wholesalers
    • Buy cheap BGA QFP QFN LGA PGA IC Type JEDEC Trays Surface Resistant Suitable For IC Packaging from wholesalers
    • Buy cheap BGA QFP QFN LGA PGA IC Type JEDEC Trays Surface Resistant Suitable For IC Packaging from wholesalers

    BGA QFP QFN LGA PGA IC Type JEDEC Trays Surface Resistant Suitable For IC Packaging

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    Brand Name : Hiner-pack
    Model Number : JEDEC TRAY SERIES
    Certification : ISO 9001 SGS ROHS
    Price : TBC
    Delivery Time : 1~2 Weeks
    Payment Terms : 100% Prepayment
    Supply Ability : 2000PCS/Day
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    BGA QFP QFN LGA PGA IC Type JEDEC Trays Surface Resistant Suitable For IC Packaging

    BGA QFP QFN LGA PGA IC Type JEDEC Trays Surface Resistant Suitable For IC Packaging

    Looking for a durable, heat-resistant tray for IC packaging? This JEDEC tray combines quality materials with exacting standards.


    JEDEC matrix trays measure 12.7 x 5.35 inches (322.6 x 136 mm) in width and length, respectively. These trays have a low-profile thickness of 0.25-inch (6.35mm). This design is suitable for storing and transporting 90% of all standard components, such as BGA, CSP, QFP, TQFP, QFN, TSOP, and SOIC.

    Features:

    • Standardization – JEDEC IC matrix trays offer compatibility with most semiconductor manufacturing equipment. For many decades of history and wide and far application, there have been many products to support JEDEC matrix trays.

    • Packaging – At the heart of it all, the JEDEC matrix trays serve as containers. The outline of the JEDEC matrix trays comes with stacking capabilities, with the top tray locking the bottom one in place.

    • Transportation & Storage – Parts that are kept inside the stacked JEDEC matrix trays are simple to keep or transport everywhere, be it several steps away or even cross-country. Moreover, JEDEC matrix trays also double up as “boats” during industrial processes, as they can hold the parts in transit through various process equipment.

    • Protection – Contained parts inside the JEDEC matrix trays are protected from mechanical damage. Moreover, most of the JEDEC matrix trays are manufactured with a material that is able to ward off ESD damage.


    Reference to the temperature resistance of different materials with the JEDEC Tray:

    MaterialBake TemperatureSurface Resistance
    PPEBake 125°C~Max 150°C1.0*10E4Ω~1.0*10E11Ω
    MPPO+Carbon FiberBake 125°C~Max 150°C1.0*10E4Ω~1.0*10E11Ω
    MPPO+Carbon PowderBake 125°C~Max 150°C1.0*10E4Ω~1.0*10E11Ω
    MPPO+Glass FiberBake 125°C~Max 150°C1.0*10E4Ω~1.0*10E11Ω
    PEI+Carbon FiberMax 180°C1.0*10E4Ω~1.0*10E11Ω
    IDP Color85°C1.0*10E6Ω~1.0*10E10Ω
    Color, temperature, and other special requirements can be customized

    Applications:

    JEDEC Matrix Trays are designed to protect and accurately hold parts in an automated environment. This makes them ideal for companies that utilize pick and place automation systems and standardized process equipment. Not only that, they simplify automation programming tasks with their well-defined component pattern.

    They can be used to hold a variety of components, such as semiconductors, electronic components, optical and photonic products, and purely mechanical parts. Generally, they are built with ESD-safe engineering plastic to prevent static electricity discharges.



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